Part Number
|
|
Revision
|
|
Layers
|
|
RoHS
|
|
Board Length
|
|
ITAR
|
|
Board Width
|
|
IPC Inspection Class
|
|
Size
|
inch
mm
|
Array
|
|
Array Length
|
|
Array Width
|
|
Array Number
|
|
X-Outs Allowed
|
|
Scoring
|
|
Countersinks/ bores
|
|
|
|
Countersinks/bores Number
|
|
Scoring Number
|
|
|
|
Jump Scoring
|
|
Controlled Dielectric
|
|
Tab-Routing
|
|
Castellated Holes
|
|
Material
|
|
Carbon Ink
|
|
Final Thickness
|
|
Blind/Buried Via
|
|
Plating
|
|
Via in Pad
|
|
Outer Cu Weight
|
|
Tented Vias |
|
Inner Cu Weight
|
|
Sides Mask
|
|
Mask Plugged Vias
|
|
Mask Color
|
|
Conductive Filled Vias
|
|
Sides Silkscreen
|
|
Controlled Impedance
|
|
Silkscreen Color
|
|
Gold Fingers
|
|
Gold Thickness
|
|
Bevel Angle
|
|
Min. Trace/Space
|
|
Min. Hole Size
|
|
Qty. Holes < 12 mi
|
|
Plated Slots
|
|
Plated Edges
|
|