Our manufacturing portfolio can meet the requirements to support virtually all industries and PCB applications. Here are some of the industries you may find our products in:
PCB International is an industry leader in innovative printed circuit board technologies. Our approach is to ensure that we have the leading-edge capabilities to meet our customer's unique product requirements and to support new design criteria. Inherent to our customer-centric approach of supplying printed circuit boards is being able to offer the largest catalog of technologies - this systematically guarantees that our valued customers have robust solutions at a single source, rather than having to go from board shop to board shop.
Combining years of experience with the latest in high-tech manufacturing efficiencies allow our pricing to be among the most competitive. Our printed circuit boards are manufactured based on IPC guidelines (minimum Class II) and comply with ISO-9001-2000, UL, and RoHS standards.
Try our online PCB quote for real-time quote and ordering. If you prefer a personalized approach to PCB quoting, send your inquiry or quote request to us at support@pcbinternational.com to get connected to one of our account managers who have the industry experience to help you get your idea to market.
ITEM | mil | mm |
---|---|---|
TRACES/SPACES | ||
Minimum Trace Width/Space (Inner) | 3.0/3.0 | 0.076/0.076 |
Minimum Trace Width/Space (External) | 3.0/3.0 | 0.076/0.076 |
Minimum SMT Pitch | 2.5 | 0.064 |
Minimum BGA Pitch | 4 | 0.1 |
DRILL | ||
Minimum Drill Size For Through Hole (Mechanical Drill) | 7.8 | 0.2 |
Minimum Drill Size For Through Hole (Laser Drill) | 3 | 0.076 |
Aspect Ratio (Mechanical Drill) | 12:1 | |
PRE-PREG LAMINATE | ||
Minimum Board Overall Thickness for 4 - Layer | 10 | 0.254 |
6 - Layer | 15 | 0.38 |
8 - Layer | 19 | 0.48 |
10 - Layer | 15 | 0.6 |
Minimum Thin Core Thickness | 2 | 0.051 |
Maximum Overall Thickness for 4-16 Layer | 250 | 6.35 |
Maximum Working Panel Size | 21" x 24" | 533.4 x 609.6 |
Maximum Layer Count | 36 Layers | |
SOLDER MASK | ||
Registration Tolerance: Layer to layer | 4 | 0.1 |
Solder mask | 2 | 0.051 |
CONTROLLED IMPEDANCE | ||
Controlled Impedance | 40-120W ± 10% | |
Diff. Controlled Impedance | 75-120W ± 10% | |
SURFACE FINISH | ||
Lead Solder (HASL) | OSP (Entek) | |
Lead Free Solder (HASL) | Carbon Ink | |
Immersion Tin | Peelable Mask | |
Immersion Silver | Deep / Hard Gold | |
Immersion Gold | Wirebondable Gold | |
MATERIAL OFFERING | ||
FR-4 (140 C Tg) | Gentek | |
FR-5 (170 C Tg) | Nelco | |
Aluminum | Polyimide | |
Arlon | Rogers 4350 | |
E-Test | UNIT | PROCESS CAPABILITY |
Flying Probe Tester | / | max 19.6" x 23.5" |
Min Spacing From Test Pad to Board Edge | mm | 0.5 |
Min Conductive Resistance | Ω | 10 |
Max Insulation Resistance | MΩ | 100 |
Max Test Voltage | V | 500 |
Min Test Pad Diameter | mil | 3.9 |
Min Test Pad to Pad Spacing | mil | 3.9 |
Max Test Current | mA | 200 |
If you have any questions or need additional information, feel free to call us at 206-310-3624 or Contact Us