Layer Count

Up to 48

• Rigid
• Rigid-Flex
• Flex
• High-Density Interconnect (HDI)
• RF Microwave
• Mix Dielectrics / Hybrid Material
• Metal Core (MCPCB)

Finish Thickness

.003" to .500"

Minimum Core Thickness

.003"

Finished Thickness Tolerance

7%

Multiple Lamination Cycles

7

Inner Copper Weights

.25 to 6 oz

Outer Copper Weights

.25 to 6 oz

• FR4 Tg 140
• FR4 Tg 170
• FR4 Tg 180
• GETEK
• Polyimide
• Rogers RF
• Taconic RF
• Arlon RF
• Duriod
• RoHS Materials
• Halogen Free
• Aluminum Backing
• Brass Backing
• Copper Backing
• Bergquist
• Laird
• C-LEC Plastic
• Speed Board
• Flex Substrates

Outer Line Width

.002"

Outer Spacing

.002"

Inner Line Width

.002"

Inner Spacing

.002"

Outer Pad Size - Annual Ring Per Side

.003"

Inner Pad Size - Annular Ring Per Side

.003"

SMT Pitch

.02"

BGA Pitch

.02"

Impedance

2.5%

• ENIG (Electroless Nickel Immersion Gold)
• Immersion Silver
• Immersion White Tin
• HASL (60/40 Tin-Lead)
• HAL (Lead-Free)
• Nickel (Electroplated)
• Palladium (Electroplated)
• Gold (Electroplated)
• Soft Wire Bondable Gold
• OSP (Organic Surface Protection)
• Carbon Ink
• Selective Plating

• ENIG (Electroless Nickel Immersion Gold)
• Immersion Silver
• Immersion White Tin
• HAL (Lead-Free)
• OSP (Organic Surface Protection)
• Soft Wire Bondable Gold

• Silver Conductive Via Filled
• Laser Drill
• Tented Vias
• Copper Conductive Via Filled
• Non-Conductive Via Filled
• Copper Plated Plugged Vias (80%) .008" Min
• Automated Planarization Capability

Laser Micro Vias

0.003"

Blind Vias

.0063"

Buried Vias

.0063"

Mechanical Drill Vias

.0063"

Tented Vias

Coated/Plugged

• Scoring (Jump)
• Scoring (Jump) Min length 1"
• Scoring Webb .014 +/- .003 Min
• Routed/Plated Edges
• Routed/Plated Pockets & Cuts Outs
• Z-Depth Routing (Plated Pockets & Cutouts)
• Cavities (Plated & Non-Plated)

• LPI (Liquid Photo Imagable Soldermask)
• Soldermask Colors
• Soldermask Type
• Dry Film Soldermask

Minimum Mask Clearance (LPI) Per Side

.001"

Minimum Mask Clearance (Dry Film)

.003"

Minimum Soldermask Thickness (LPI)

.0004"

Minimum Soldermask Thickness (Dry Film)

.003"

Soldermask Web Minimum (LPI)

.003"

Soldermask Web Minimum (Dry Film)

.008"

• Silkscreen/Legend Colors
• Silkscreen/Legend Feature Size

Silkscreen/Legend Feature Size

.008" W X .030 H Min.

• Netlist Testing
• Flying Probe
• Clamshell Fixture
• Netlist IPC-356A

• Controlled Impedance Testing
• TDR Tester (Polar Instruments)

Impedance tolerance (+/-)

2.50%

• Genesis 2000
• ODB++
• FTP Site