Our manufacturing portfolio can meet the requirements to support virtually all industries and PCB applications. Here are some of the industries you may find our products in:
PCB International is an industry leader in innovative printed circuit board technologies. Our approach is to ensure that we have the leading-edge capabilities to meet our customer's unique product requirements and to support new design criteria. Inherent to our customer-centric approach of supplying printed circuit boards is being able to offer the largest catalog of technologies - this systematically guarantees that our valued customers have robust solutions at a single source, rather than having to go from board shop to board shop.
Combining years of experience with the latest in high-tech manufacturing efficiencies allow our pricing to be among the most competitive. Our printed circuit boards are manufactured based on IPC guidelines (minimum Class II) and comply with ISO-9001-2000, UL, and RoHS standards.
Try our online PCB quote for real-time quote and ordering. If you prefer a personalized approach to PCB quoting, send your inquiry or quote request to us at support@pcbinternational.com to get connected to one of our account managers who have the industry experience to help you get your idea to market.
| ITEM | mil | mm |
|---|---|---|
| TRACES/SPACES | ||
| Minimum Trace Width/Space (Inner) | 3.0/3.0 | 0.076/0.076 |
| Minimum Trace Width/Space (External) | 3.0/3.0 | 0.076/0.076 |
| Minimum SMT Pitch | 2.5 | 0.064 |
| Minimum BGA Pitch | 4 | 0.1 |
| DRILL | ||
| Minimum Drill Size For Through Hole (Mechanical Drill) | 7.8 | 0.2 |
| Minimum Drill Size For Through Hole (Laser Drill) | 3 | 0.076 |
| Aspect Ratio (Mechanical Drill) | 12:1 | |
| PRE-PREG LAMINATE | ||
| Minimum Board Overall Thickness for 4 - Layer | 10 | 0.254 |
| 6 - Layer | 15 | 0.38 |
| 8 - Layer | 19 | 0.48 |
| 10 - Layer | 15 | 0.6 |
| Minimum Thin Core Thickness | 2 | 0.051 |
| Maximum Overall Thickness for 4-16 Layer | 250 | 6.35 |
| Maximum Working Panel Size | 21" x 24" | 533.4 x 609.6 |
| Maximum Layer Count | 36 Layers | |
| SOLDER MASK | ||
| Registration Tolerance: Layer to layer | 4 | 0.1 |
| Solder mask | 2 | 0.051 |
| CONTROLLED IMPEDANCE | ||
| Controlled Impedance | 40-120W ± 10% | |
| Diff. Controlled Impedance | 75-120W ± 10% | |
| SURFACE FINISH | ||
| Lead Solder (HASL) | OSP (Entek) | |
| Lead Free Solder (HASL) | Carbon Ink | |
| Immersion Tin | Peelable Mask | |
| Immersion Silver | Deep / Hard Gold | |
| Immersion Gold | Wirebondable Gold | |
| MATERIAL OFFERING | ||
| FR-4 (140 C Tg) | Gentek | |
| FR-5 (170 C Tg) | Nelco | |
| Aluminum | Polyimide | |
| Arlon | Rogers 4350 | |
| E-Test | UNIT | PROCESS CAPABILITY |
| Flying Probe Tester | / | max 19.6" x 23.5" |
| Min Spacing From Test Pad to Board Edge | mm | 0.5 |
| Min Conductive Resistance | Ω | 10 |
| Max Insulation Resistance | MΩ | 100 |
| Max Test Voltage | V | 500 |
| Min Test Pad Diameter | mil | 3.9 |
| Min Test Pad to Pad Spacing | mil | 3.9 |
| Max Test Current | mA | 200 |
If you have any questions or need additional information, feel free to call us at 206-310-3624 or Contact Us