Layer

Item English

Layer Count

Up to 48

Board Types

  • Rigid
  • Rigid-Flex
  • Flex
  • High-Density Interconnect (HDI)
  • RF Microwave
  • Mix Dielectrics / Hybrid Material
  • Dielectrics With Metal Core/Backing
Item English

Finish Thickness

.003" to .500"

Minimum Core Thickness

.003"

Finished Thickness Tolerance

7%

Multiple Lamination Cycles

7

Inner Copper Weights

.25 to 6 oz

Outer Copper Weights

.25 to 6 oz

Laminate Materials

  • FR4 Tg 140
  • FR4 Tg 170
  • FR4 Tg 180
  • GETEK
  • Polyimide
  • Rogers RF
  • Taconic RF
  • Arlon RF
  • Duriod
  • RoHS Materials
  • Halogen Free
  • Aluminum Backing
  • Brass Backing
  • Copper Backing
  • Bergquist
  • Laird
  • C-LEC Plastic
  • Speed Board
  • Flex Substrates

Pad, Lines & Spacing Diameters

Item English Metric

Outer Line Width

.002"

0.0508 mm

Outer Spacing

.002"

0.0508 mm

Inner Line Width

.002"

0.0508 mm

Inner Spacing

.002"

0.0508 mm

Outer Pad Size - Annual Ring Per Side

.003"

0.0762 mm

Inner Pad Size - Annular Ring Per Side

.003"

0.0762 mm

SMT Pitch

.02"

0.508 mm

BGA Pitch

.02"

0.508 mm

Impedance

2.5%

Plating

  • ENIG (Electroless Nickel Immersion Gold)
  • Immersion Silver
  • Immersion White Tin
  • HASL (60/40 Tin-Lead)
  • HAL (Lead-Free)
  • Nickel (Electroplated)
  • Palladium (Electroplated)
  • Gold (Electroplated)
  • Soft Wire Bondable Gold
  • OSP (Organic Surface Protection)
  • Carbon Ink
  • Selective Plating

RoHS

  • ENIG (Electroless Nickel Immersion Gold)
  • Immersion Silver
  • Immersion White Tin
  • HAL (Lead-Free)
  • OSP (Organic Surface Protection)
  • Soft Wire Bondable Gold

Via Holes

  • Silver Conductive Via Filled
  • Laser Drill
  • Tented Vias
  • Copper Conductive Via Filled
  • Non-Conductive Via Filled
  • Copper Plated Plugged Vias (80%) .008" Min
  • Automated Planarization Capability
Item English

Laser Micro Vias

0.002 *

Blind Vias

.0063"

Buried Vias

.0063"

Mechanical Drill Vias

.0063"

Tented Vias

Coated/Plugged

Routing/Scoring

  • Scoring (Jump)
  • Scoring (Jump) Min length 1"
  • Scoring Webb .014 +/- .003 Min
  • Routed/Plated Edges
  • Routed/Plated Pockets & Cuts Outs
  • Z-Depth Routing (Plated Pockets & Cutouts)
  • Cavities (Plated & Non-Plated)

Soldermask

  • LPI (Liquid Photo Imagable Soldermask)
  • Soldermask Colors
  • Soldermask Type
  • Dry Film Soldermask
Item English

Minimum Mask Clearance (LPI) Per Side

.001"

Minimum Mask Clearance (Dry Film)

.003"

Minimum Soldermask Thickness (LPI)

.0004"

Minimum Soldermask Thickness (Dry Film)

.003"

Soldermask Web Minimum (LPI)

.003"

Soldermask Web Minimum (Dry Film)

.008"

Silkscreen/Legend

  • Silkscreen/Legend Colors
  • Silkscreen/Legend Feature Size
Item English

Silkscreen/Legend Feature Size

.008" W X .030 H Min.

Electrical Testing

  • Netlist Testing
  • Flying Probe
  • Clamshell Fixture
  • Netlist IPC-356A

Controlled Impedance

  • Controlled Impedance Testing
  • TDR Tester (Polar Instruments)
Item English

Impedance tolerance (+/-)

2.50%

CAM

  • Genesis 2000
  • ODB++
  • FTP Site
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